Why people are so much interested about SiP technology

Advanced packaging, which enables a new level of chipping for a single application, equips any warehouse. These packages include technologies such as System in Package (SiP), 3D/2.5D chiplets, and streaming. In advanced packages, each offers multiple options for integrating and assembling complex components or dies, giving chip customers a variety of opportunities to differentiate the design and development of their new ICs. . IC vendors are looking for IC packages with better electrical performance and smaller size. SiP compared to 3D/2.5D is cheaper media and requires more R&D. SiP is also less rigid than chiplets. A system package combines multiple components into a single package, allowing the package to function as a subsystem or electronic system. The customer can customize their SiP by adding passives, arrays, MEMS, and antennas according to their needs. SiP is used in various products such as smart watches, smartphones, car systems, etc. These SiPs are widely used in WiFi modules, RF front end and power supply ICs.

The most popular smartwatch in the market that has built-in SiP. By adopting System in Package technology, the company can develop more functions in its generation of smartwatch products from generation to generation. A few other types of SiP are developing, such as Heterogeneous System-in-Package (HSiP). The SiP developed by USI is very different from that developed by OSAT manufacturers. At USI, our strengths in SiP are in the area of ​​product development for system applications. While our OSAT partner, ASE, focuses on new chip-level technologies, USI offers customers complete SiP solutions for miniaturized system modules, from detailed design to module manufacturing.

Why use SiP in your products

Reduced size (XY) to have more space for battery and new functions

Reduce thickness (Z) and weight for an elegant ID design

Reduce the difficulty of Fatp

Improve integrity

EMI interference shield

Accelerate development

Better reliability - humidity and temperature

Faster and better inventory management

The current SiP has a long "running time". Today, ASSSiP USI tries to reduce or shorten lead times by creating standard SiP products for specific projects or applications. For example, the performance of the product can be demonstrated when some functional blocks can be connected through SiP / SiM, which can significantly reduce and reduce the size of the motherboard to make room for the battery, thus extending the life of the battery .

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